Image Transforms (S) Pte Ltd
KerfAid™ - the original dicing surfactant invented by Dynatex and enhanced by research at Stanford University is now available via The Millice Group of companies under a a global license agreement to produce and market the products. Dicing surfactant is a critical material for anyone sawing and dicing semiconductor materials. KerfAid™ surfactant removes waste material, reduces surface tension, lubricates saw blades, inhibits corrosion, and dissipates ESD during the dicing process. Dicing solutions, cleaning solutions, and dispensing systems are manufactured and sold through Image Transforms (S) Pte Ltd, a subsidiary of The Millice Group. Headquartered in Singapore.
Millice Pte Ltd
Workpiece temporary adhesive materials - conductive and high temperature. WaferGrip™ and TrueGrip™ are advanced composite film adhesives engineered to bond wafers, thin film heads, optics, and other substrates during dicing, grinding, lapping, and polishing. StripAid™ X Solvent is a biodegradable hydrocarbon plasticizer used for debonding WaferGrip™ temporary adhesive, leaving no debris or residue behind. These materials are manufactured and sold through Millice Pte Ltd, a subsidiary of The Millice Group. Headquartered in Singapore.
Microsanj LLC
High-resolution and high-speed, thermal imaging systems based on thermoreflectance and infrared technologies. Systems support thermal design validation and device characterization in microelectronic, optoelectronic, RF, Microwave, and other applications. Consulting service and system sales offered via headquarters in Santa Clara, CA.